Controls That Run the World
> Industrial-grade electronics manufacturing from Shenzhen's Longhua/Bao'an cluster. 20 years of rugged reliability.
Industrial Control Assemblies
Thick-copper PCB (up to 4oz), heavy-duty assembly, full environmental protection. Every board tested to spec.
PLC Control Boards
Multi-layer CPU boards with isolated I/O, RS-485/232, industrial temp grade components.
VFD / Motor Drivers
IGBT-based drives up to 15kW, vector control, overload protection, heavy-copper power planes.
Sensor Modules
Analog/digital sensor interfaces, 4-20mA, 0-10V signal conditioning, RTD/thermocouple inputs.
HMI Panels
Resistive/capacitive touch assemblies, sunlight-readable displays, NEMA/IP65 front bezel integration.
Industrial IoT Gateways
Edge computing nodes with 4G/5G, WiFi 6, LoRa, Modbus TCP/RTU, MQTT, OPC-UA support.
DIN-Rail Power Supplies
AC/DC converters 24VDC, 12VDC, 48VDC output. 85-264VAC universal input, active PFC, 150% peak.
Relay Modules
Electromechanical/SSR, 8/16-channel, coil suppression, status LED, pluggable terminal blocks.
EtherCAT / Profinet Boards
Real-time industrial Ethernet slaves, <1ms cycle, daisy-chain topology, built-in PHY, EMC compliant.
Built for the Factory Floor
Rugged electronics that survive where consumer gear fails. Every process engineered for harsh environments.
01 Conformal Coating
Acrylic, silicone, and parylene coating options. Automated selective coating with 100% AOI inspection. Protection against moisture, dust, chemicals, and salt spray.
25-75μm
99.5%+
02 Thick-Copper PCB
Up to 4oz (140μm) copper weight for high-current power electronics. Heavy copper plating with controlled impedance for motor drives and power supplies.
4 oz
6/6 mil
03 Potting & Encapsulation
Vacuum potting with epoxy, polyurethane, or silicone compounds. Complete environmental sealing for submersible and explosive-atmosphere applications.
Up to IP68
0.8-3.0 W/mK
04 Thermal Management
Aluminum core PCBs, thermal vias, heatsink bonding, phase-change TIM application. Designed for -40°C cold start to +85°C continuous operation.
-40~85°C
Phase-Change
05 Mixed SMT/THT Assembly
10 SMT lines + selective wave soldering for mixed-technology boards. BGA, QFN, 0201 placement capability. Automated optical + X-ray inspection.
0201
0.4mm
06 Box Build & System Integration
Full turnkey: PCB assembly to enclosure, wiring harness, functional test, labeling, and custom packaging. DIN-rail and panel-mount integration.
IP65/NEMA
UL 758
Ready to Build?
Send us your BOM, Gerbers, and target specs. Our NPI team responds with a DFM report and quotation within 24 hours.