Quality | EMS-INDUSTRIAL

99.87%

First-Pass Yield

SMT lines, rolling 12mo

< 12

DPPM

Defects per million

100%

AOI Coverage

Every solder joint

100%

X-Ray on BGA/QFN

Hidden joint inspection

0

Field Returns

Class 3 boards, CY2025

01 Environmental Protection

Every industrial board faces moisture, dust, chemicals, and temperature extremes. Our protection processes ensure your electronics survive the worst the factory floor can throw at them.

Conformal Coating

Automated selective coating with 3-axis robotic dispensing. 100% AOI verification of coating coverage. Three chemistry options for different environments.

Acrylic (AR) — general moisture protection, reworkable
Silicone (SR) — high-temp flexibility, -55 to +200°C
Parylene (XY) — vapor-deposited, pinhole-free, MIL-I-46058C

Potting & Encapsulation

Vacuum potting chambers eliminate air bubbles for complete encapsulation. Custom mold tooling for complex geometries. Up to IP68 protection.

Epoxy — rigid, chemical resistant, 0.8-2.0 W/mK thermal
Polyurethane — flexible, low exotherm, re-enterable
Silicone gel — soft, -60 to +250°C, optical clarity option

Thermal Management

Designed for -40°C cold start to +85°C continuous. Every thermal solution verified by IR thermography under full load.

Aluminum-core (IMS) PCB for direct heatsink bonding
Thermal via arrays — 0.3mm pitch, 25μm copper plating
Phase-change TIM — 3.0 W/mK, automatic application
Gap-pad — 0.5-5.0mm thickness, 1.0-12.0 W/mK

02 Test & Validation

Beyond standard ICT and FCT. Every industrial product is stressed beyond its rated limits to guarantee field reliability.

Burn-In / HASS

48-168 hour powered burn-in at +85°C ambient. Highly Accelerated Stress Screening on every Class 3 production lot.

IEC 60068-2-2

Thermal Cycling

-40°C to +85°C, 1000 cycles, 30 min dwell, 15°C/min ramp. Solder joint reliability validated by cross-section after cycling.

IEC 60068-2-14 Na

Random Vibration

10-2000 Hz, 5g RMS, 3 axes, 2 hrs/axis. Unpopulated resonance search + populated endurance. No solder cracks, no component damage.

IEC 60068-2-64

EMC Pre-Compliance

Conducted/radiated emissions and immunity pre-scan. In-house GTEM cell up to 3 GHz. Full compliance at partner lab for formal certification.

IEC 61000-4-x / CISPR 32

X-Ray Inspection

2D and 3D (CT) X-ray on 100% of BGA, QFN, and hidden-solder-joint assemblies. Void analysis per IPC-7095. Automated pass/fail classification.

IPC-7095 Class 3

In-Circuit Test (ICT)

Flying-probe and bed-of-nails ICT on 100% of production. Component value verification, polarity check, shorts/opens, boundary scan (JTAG).

IEEE 1149.1

03 Process Control

Statistical process control on every critical parameter. Real-time monitoring with automatic line-stop on out-of-spec conditions.

Process Step	Control Method	Frequency	Cpk Target	Standard
Solder Paste Print	SPI (Solder Paste Inspection)	100% of boards	≥ 1.67	IPC-7527
Pick & Place	AOI pre-reflow + post-reflow	100% of placements	≥ 1.33	IPC-9850
Reflow Profile	12-zone profile, 2x/day verification	Per lot	≥ 2.0	J-STD-020
Wave Solder	Contact angle + temp + conveyor speed	Continuous	≥ 1.67	IEC 61191-3
Conformal Coating	Viscosity + thickness + UV inspection	Every board	≥ 1.33	IPC-CC-830
Functional Test	Custom bed-of-nails + boundary scan	100%	—	Per customer spec
Final Inspection	7x microscope + endoscope for THT	100%	—	IPC-A-610 Class 3

04 Certifications

Certified to international standards for industrial electronics manufacturing.

✓ UL 508 Industrial Control Equipment ✓ CE Marking (EMC + LVD + RoHS) ⚙ ATEX / IECEx (via Partner) ✓ ISO 9001:2015 ✓ IPC-A-610 Class 3 Acceptability ✓ J-STD-001 Soldering Requirements ✓ RoHS 3 / REACH Compliant ⚙ IATF 16949 (Automotive Partner) ✓ IEC 61131-2 PLC EMC

Zero-Defect Manufacturing

IPC-A-610 Class 3

J-STD-001

ISO 9001:2015

IEC 61131-2